Intel aims to achieve 1T transistors on a package by 2030 using chiplets (techspot.com) 2 points by Zuider 3y ago ↗ HN
[–] eimrine 3y ago ↗ Will they be shock-proof or of course they will not? [–] Zuider 3y ago ↗ So you could drop your laptop, only to find lots of little wafers spilling out of the fan vents? [–] eimrine 3y ago ↗ This works slightly different. One pin may be enough, several pins is enough always.
[–] Zuider 3y ago ↗ So you could drop your laptop, only to find lots of little wafers spilling out of the fan vents? [–] eimrine 3y ago ↗ This works slightly different. One pin may be enough, several pins is enough always.
[–] eimrine 3y ago ↗ This works slightly different. One pin may be enough, several pins is enough always.
[–] LargoLasskhyfv 3y ago ↗ I smell yummie fumes of glue!cf. (·) https://duckduckgo.com/?q=intel+vs.+amd+'glued+together'Resentfully yours ;->
4 comments
[ 5.0 ms ] story [ 20.9 ms ] threadcf. (·) https://duckduckgo.com/?q=intel+vs.+amd+'glued+together'
Resentfully yours ;->