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Watch the PACE videos as well, they’re on YouTube and they also cover how to remove conformal coating and using different tools.
Missing: how to solder a wire to the thermal pad on the bottom side of an IC. Assume there are components on the back side.
Isn't it just ground? If not, can you drill a corner of the chip? Most of chip material is just plastic.
If it's QFN, you're probably best deadbugging it and jumpering all of the pins individually, but first make sure that you need the connection. QFP wireframes all have a center pad, whether or not it's electrically connected to the die or needed for thermal dissipation.

If it's an SO package, e.g. SSOP, TSOP, etc., Desolder the IC, add the jumper wire, bend the pins down enough to account for the thickness of the jumper wire, and resolder the IC.

Either way, make sure you have enough thermal mass connected to it for thermal dissipation. If there's components on the opposite side of the PCB, it's probably not much.

Almost 30 years old. Old good times without BGAs and modern barely visible components. While some basics are still applicable the modern problems are not covered at all.
Provided you have good eyesight and steady hands, I've mostly found what happens as you get smaller is:

- Heating becomes easier. There's no large sinks to take the heat away. It's also easier to overheat things.

- You need finer tweezers, and don't drop them because if you do the tips will bend.

- The solder's surface tension does more of the work. It feels a lot more like sticking together things with tiny droplets of glue. Having the correct amount of solder in the right place is critical.

- Solder and flux become two separate things you have to care about individually

- It is easier to burn yourself

- learning how to brace your hand against something in a way that gives you very fine control. One reason soldering with an iron can be difficult is because your hand is so far away from the tip, like trying to write with a pen held by the end.

Provided you have good eyesight and steady hands

I see the flaw in your clever plan...

It started getting really annoying earlier with PGA, to be honest.
I have a problem of dismounting brittle SATA ports, maybe I just need more preheating but they are sitting really tight in the board.
> Destructive static charges are induced on nearby conductors, such as human skin, and delivered in the form of sparks passing between conductors, such as when the surface of printed board assembly is touched by a person having a static charge potential. [..] It is important to note that usually the static damage level for components cannot be felt by humans. (Less than 3,000 volts.)

Less than 3000 volts cannot be felt by humans? Should be 3000 millivolts right? i.e. 3 volts...