A Niche Technology Became a Choke Point for A.I (nytimes.com)

>The packaging bottleneck has become a hot topic in Silicon Valley as TSMC has struggled to keep up with demand. Dr. Iyer tried to help by developing plans for a packaging research and development center, funded with $1.1 billion from the Biden administration and slated to be built in Arizona, but the Trump administration effectively killed the effort last year.

Crazy how dependent on politics these projects are.