Expert here. Worked in a Fab (Automated Material Handling Systems or AMHS group).

You might be suprised how automated it already is [1]. Notice the OHTs (Overhead Hoist Transport)[2] running on a system of highways and superhighways on the ceiling. Each of these OHTs carry a box inside it called a FOUPs (Front Opening Unified Pods)[3] carrying upto 25 wafers. That can easily be worth $1M+ per box. They have standardized JEDEC interfaces so any process tool can accept a FOUP and get wafers out of it. The environment inside these FOUPs is ridiculously clean and each one costs $15k for what most people would think is a plastic box with a door in the front. FOUPs are used internally. If wafers are shipped, they're shipped in a similar box called FOSB or Front Opening Shipping Boxes [4]. These boxes are the reason automation happens with standardized "APIs". We don't need to know who made the process tool to hand them a box of wafers.

Another automation feature are the AGVs or Automated Guided Vehicles [5] that carry the same FOUPs and FOSBs [5]. They also can be equipped with a robot arm that takes a wafer out of the box and hands it over to the tool. The AGVs run on specialized roads inside the Fab and remains docked on the tool during processing.

Usually, there are hardly any humans around the tool. Material (wafer) is fed by AMHS systems, picked up by the same. Fab is probably one of the most automated manufacturing places out there. Way more than Automotive manfacturing.

If you're looking to do software engineering, I would highly encourage people to go work in semiconductor industry. It is just a fucking cool place and lot of room for improvement still.

[1] https://www.youtube.com/watch?v=MRlcZqqyBM8

[2] https://www.muratec.net/cfa/products/

[3] https://www.entegris.com/shop/en/USD/Products/Wafer-Handling...

[4] https://en.wikipedia.org/wiki/FOUP#/media/File:Front_opening...

[5] https://www.muratec-usa.com/machinery/clean-room/transport/A...