You're quite right, a traditional die with 6.8 billion transistors on it would likely have serious yield issues. This is why Xilinx is using the silicon interposer to combine multiple die into a single package. So it's…
You're quite right, a traditional die with 6.8 billion transistors on it would likely have serious yield issues. This is why Xilinx is using the silicon interposer to combine multiple die into a single package. So it's…